Features:
1.T4 Pro degumming and tin planting platform, support iPhone / Huawei / OPPO / vivo / Honor / Xiaomi / Samsung and other models a total of 102 models of chips.
2.The 2-in-1 design greatly helps the maintenance master to save costs and plant tin efficiency.
3.Magnetic automatic clamping, universal 3D planting tin net, removing the glue card, precise positioning.
4.Clamping precision, more stable operation, not easy to damage the chip.
5.Using a new type of magnetic dynamic positioning, strong magnetic clamping stable, automatic alignment.
6.It has wear-resistant, anti-slip, shock-absorbing, anti-aging, non-toxic tasteless, and high-temperature resistance.
7.Selected high-quality steel, fine workmanship, wear resistance, high toughness support tin planting.
8.Support unlimited expansion, a total of 76 types of chips.
Supported models are as follows:
1. For Qualcomm: MSM8909/8905, MSM8916/8939, MSM8917, MSM8953, MSM8953 1AB, MSM8937/8940, MSM8996, SM8150, SM8250, SM8250-002, SM8350, SM8450, SM8475, SM8550, SM8650, SM6115, SM7225-00AB, SM7250, SM7325, SM7350, SM7550, SDM439, SDM636, SDM710, SDM845, SM665, SM6150, SM8750, SM730G, SM7150, SM680, SM6225, SM7475, SM6450, SM720, SM7125, SM8635, SM4450, SM7635, SM8850, SM6450/SM7435
2. For MTK Dimensity: MT6761V/6762V/6765V, MT6885Z, MT6895Z, MT6893Z, MT6855V, MT6853V, MT6877V, MT6769V, MT6873V, MT6833V, 1100/1200, 9200, 9300, MT8781, MT6789V, MT6897Z
3. For Android RAM: BGA 376, BGA 436, BGA 496, BGA 556
4. For Samsung Exynos: 990, 8895, 980, 2100, 2200, 9820, 8830, E8835P, E882S, 7884/7885/7904, E8845, E8535P
5. For Huawei Hisilicon: HI3660, HI9290/L, HI6280, HI3690 5G, HI3680, HI36A0, HI3670, HI36A0, HI6260, HI3690 4G, HI6290, HI36CO
6. For Apple: A8, A9, A10, A11, A12, A13, A14, A15, A16, A17, A18, A18 Pro, A19, A19 Pro
Package includes:
1 x Fixture
17 x Stencil
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