JTX M29 Middle Layer BGA Reballing Stencil Tin Planting Platform for iPhone X to 17 Pro Max

1. Dedicated soldering fixture for mid-layer motherboard repair, suitable for mid-layer resoldering repair of Apple 11-17 series motherboards.
2. Zero positioning error and no wobbling; precise alignment of the motherboard and stencil for stable soldering results.
3. Built-in strong magnet automatically attracts and fixes the soldering stencil, eliminating the need for manual alignment; the stencil remains stable and does not shift during the soldering process.
4. Anti-static and corrosion-resistant; withstands high-temperature operation with hot air guns; prevents solder explosion and improves repair and soldering efficiency.
5. Square-hole stencil is less prone to clogging; ensures even and full soldering, guaranteeing the quality of mid-layer solder joints on the motherboard.
6. Shared base; only the positioning mold and stencil need to be replaced to adapt to different models.